Samsung's Jun Young-hyun Meets Jensen Huang, Discusses Long-Term Cooperation Including HBM4E and HBM5

Jun Young-hyun, Vice Chairman and CEO of Samsung Electronics' Device Solutions (DS) Division, who leads the company's semiconductor business, announced on Monday that he discussed the supply of seventh- and eighth-generation High Bandwidth Memory (HBM) products, HBM4E and HBM5, following a meeting with Nvidia CEO Jensen Huang.

After meeting with Huang and other key Nvidia executives at The Shilla Seoul in Jung-gu, Seoul, on Monday, Vice Chairman Jun responded to reporters' questions about cooperation with Nvidia, saying, "We have cooperated with CEO Huang for a long time, and I think we had the best conversation today."

"We discussed a lot of long-term cooperation starting next year, including HBM4E, the foundry (contract chip manufacturing) business, and HBM5," Jun said. "In the short term, we must sufficiently supply HBM4 and SOCAMM (Small Outline Compression Attached Memory Module, a low-power memory module for servers) starting this year."

When asked about expanding foundry cooperation, he replied, "We are cooperating on autonomous driving chips required for 4-nanometer and 8-nanometer processes, as well as Nvidia's Groq accelerator chip, and we are also discussing cooperation for the next generation."

Nvidia Senior Director Madison Huang, who is Huang's eldest daughter, and Nvidia Senior Vice President Jeff Fisher were reportedly present at the meeting.

From Samsung Electronics, Vice Chairman Jun and Kim Jae-june, Executive Vice President of the Memory Business, among others, attended the meeting.

Samsung Electronics is supplying HBM4 (sixth-generation), which achieves an industry-leading performance of over 11.7 Gbps (gigabits per second), for Nvidia's next-generation artificial intelligence (AI) accelerator, "Vera Rubin," which has entered full-scale mass production.

The company is also supplying LPDDR5X-based SOCAMM2 for the Vera central processing unit (CPU) and PCIe Gen6-based PM1763 for storage.

Recently, Samsung became the first in the world to complete sample shipments of its seventh-generation product, HBM4E, and supplied the samples to Nvidia.

Samsung's HBM4E combines the most advanced 1c DRAM core die with its own foundry 4-nanometer process base die, operating at 14 Gbps per pin and successfully achieving up to 16 Gbps (with a maximum bandwidth of 4 TB/s).

Regarding CEO Huang's previous remark about SK Hynix being "Nvidia's largest memory partner and will continue to be so," Vice Chairman Jun said, "We will work hard on our own business," adding, "We will show it through results later."

When asked if Samsung Electronics also plans to sign a long-term memory supply contract with Nvidia, he replied, "We will do our absolute best to help Nvidia succeed as their top partner."

Following the meeting, Vice Chairman Jun immediately attended Nvidia's "Korea AI Ecosystem" reception.

Han Jin-man, President of the Foundry Business; Kim Yong-kwan, President of the DS Corporate Strategy Office; and Song Yong-ho, Head of the DS AI Center, were also reportedly in attendance.

As the event brought together major domestic figures related to artificial intelligence, it is interpreted that Samsung Electronics' key executives involved in AI chip production were present.

Meanwhile, the Nvidia event was also attended by SK Hynix CEO Kwak Noh-jung, LG Electronics CEO Lyu Jae-cheol, and LG Innotek CEO Moon Hyuk-soo, among others.

(Photo: Yonhap News)
※ Please note: This article was translated by AI and may contain errors.